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     Research Journal of Applied Sciences, Engineering and Technology


Improvement of the Thermal Conductivity of a Composite Material has Clay Base

1Azibert Oumar Abdelhakh, 2Oumar Idriss Hamid, 1Malloum Soultan, 1Mahamat Barka, 3Mamadou Adj and 4Salif Gaye
1Institut Universitaire des Sciences et Techniques d’Abéché, Tchad
2Faculté des Sciences Exactes, Université de N’Djamena, Tchad
3Ecole Supérieure Polytechnique, Université Cheikh Anta Diop de DAKAR, Sénégal
4Institut Universitaire des Technologie, Université de Thiès, Sénégal
Research Journal of Applied Sciences, Engineering and Technology   2015  9:962-968
http://dx.doi.org/10.19026/rjaset.11.2135  |  © The Author(s) 2015
Received: April ‎27, ‎2015  |  Accepted: ‎July ‎26, ‎2015  |  Published: November 25, 2015

Abstract

This study report to the improvement of thermo physical properties of cooked clay to obtain a porous and thermal conductor material. For this purpose we fabricates two series of samples having as base material a caolinitic clay of Thicky (Senegal) to which we added respectively cow dung and the copper filings. The tests of characterization that we have carried out showed us an increase of thermal conductivity from 0.308 to 0.476 W/m.K witch corresponding to an optimum percentage of 10% by volume in cow dung and 4% of copper. It would be interest to increase dosage in copper to obtain high value of conductivity.

Keywords:

Clay , copper, cow dung, porosity, thermal characteristics,


References


Competing interests

The authors have no competing interests.

Open Access Policy

This article is distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution, and reproduction in any medium, provided you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made.

Copyright

The authors have no competing interests.

ISSN (Online):  2040-7467
ISSN (Print):   2040-7459
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